Lista de procesadores Intel Core

La siguiente es una lista de procesadores Intel Core . Esto incluye la serie móvil Core (Solo/Duo) original de Intel basada en la microarquitectura Enhanced Pentium M , así como sus procesadores de marca Core 2 (Solo/Duo/Quad/Extreme), Core i3, Core i5, Core i7, Core i9, Core M (m3/m5/m7), Core 3, Core 5 y Core 7.

Procesadores de escritorio

Núcleo 2

"Allendale" (65 millas náuticas, 800 MT/s)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2) ^y
Tamaño de la matriz : 111 mm ²
Pasos : L2 ^b , M0 ^c , G0 ^d

^c Nota: Los pasos M0 y G0 tienen mejores optimizaciones para reducir el consumo de energía en reposo de 12 W a 8 W.

^d Nota: El E4700 utiliza G0 Stepping , lo que lo convierte en una CPU Conroe.

"Conroe" (65 millas náuticas, 1066 MT/s)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2) ^y
Todos los modelos son compatibles con: Intel VT-x
Tamaño de la matriz : 143 mm ²
Pasos : B2 , G0

^a Nota: de los procesadores de la serie E6000, solo los modelos E6550, E6750 y E6850 son compatibles con la tecnología Trusted Execution Technology (TXT) de Intel.^[1]

^b Nota: El L2 Stepping y los modelos con sSpec SL9ZL, SL9ZF, SLA4U, SLA4T tienen mejores optimizaciones para reducir el consumo de energía en reposo de 22 W a 12 W.^[2]

^c Nota: Los pasos M0 y G0 tienen mejores optimizaciones para reducir el consumo de energía en reposo de 12 W a 8 W.

"Conroe" (65 millas náuticas, 1333 MT/s)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2) ^y
Todos los modelos son compatibles con: Intel VT-x
Todos los modelos E6x50 son compatibles con: Intel VT-x , Trusted Execution Technology (TXT)
Tamaño de la matriz : 143 mm ²
Número de transistores : 291 millones
Pasos : B2 , G0

^a Nota: de los procesadores de la serie E6000, solo los modelos E6550, E6750 y E6850 son compatibles con la tecnología Trusted Execution Technology (TXT) de Intel.^[1]

^b Nota: El L2 Stepping y los modelos con sSpec SL9ZL, SL9ZF, SLA4U, SLA4T tienen mejores optimizaciones para reducir el consumo de energía en reposo de 22 W a 12 W.^[2]

^c Nota: Los pasos M0 y G0 tienen mejores optimizaciones para reducir el consumo de energía en reposo de 12 W a 8 W.

"Conroe-CL" (65 millas náuticas, 1066 MT/s)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Tamaño de la matriz : 111 mm2 ⁽ Conroe)
Pasos : ?

"Conroe XE" (65 millas náuticas)

^[3]^[4]

Estos modelos cuentan con un multiplicador de reloj desbloqueado .

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Tamaño de la matriz : 143 mm ²
Pasos : B1, B2
El X6900 nunca fue lanzado al público.

"Kentsfield" (65 millas náuticas)

^[7]^[8]

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x
Tamaño de la matriz : 2 × 143 mm ²
Pasos : B3, G0

"Kentsfield XE" (65 millas náuticas)

^[10]

Estos modelos cuentan con un multiplicador de reloj desbloqueado .

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x
Tamaño de la matriz : 2 × 143 mm ²
Pasos : B3, G0

"Wolfdale-3M" (45 millas náuticas, 1066 MT/s)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2)
Tamaño de la matriz : 82 mm ²
Número de transistores: 230 millones
Pasos : M0, R0
Los modelos con un número de pieza que termina en "ML" en lugar de "M" son compatibles con Intel VT-x

"Wolfdale" (45 millas náuticas, 1333 MT/s)

Todos los modelos (excepto E8190) admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), iAMT2 ( Intel Active Management Technology ), Intel VT-x ^[a] , Intel VT-d ^[b] , Trusted Execution Technology (TXT)
Tamaño de la matriz : 107 mm ²
Número de transistores: 410 millones
Pasos : C0, E0

a Nota: Los modelos E8190 y E8290 no son compatibles con Intel VT-d.

Nota 2: El modelo E8700 es un caso muy poco frecuente en la historia de Intel, en el que un modelo fue retirado de Intel ARK sin un aviso de retirada y después de que se le asignara una SSPEC. Se vieron ejemplares en funcionamiento, que se cree que fueron entregados a los fabricantes de equipos originales ^[12] , pero ninguno se ofreció en PC minoristas.

Ver también: Versiones del mismo núcleo Wolfdale en un LGA 771 están disponibles bajo la marca Dual-Core Xeon .

"Yorkfield-6M" (45 millas náuticas)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x ^[a] , Intel VT-d ^[b] , Trusted Execution Technology (TXT) ^[c]
Tamaño de la matriz : 2 × 82 mm ²
Pasos : M0, M1, R0
Todos los modelos Q8xxx son MCM Yorkfield-6M con solo 2 × 2 MB de caché L2 habilitados.

a Nota: Q8200, Q8200S, Q8300 SLB5W no son compatibles con Intel VT-x.

b Nota: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 no son compatibles con Intel VT-d.

c Nota: Q8200, Q8200S, Q8300, Q8400, Q8400S no admiten TXT.

Yorkfield (45 millas náuticas)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Intel VT-d , Trusted Execution Technology (TXT)
Tamaño de la matriz : 2 × 107 mm ²
El sufijo "S" indica especificaciones de bajo consumo de energía con TDP de 65 W, equivalente al de un Core 2 Duo estándar. Se suministra solo para canales OEM y se considera principalmente como opción para plataformas SFF. El primer lote de Q9550S no tiene la marca "S" en la tapa, por lo que solo se diferencia por SSPEC.
Pasos : C0, C1, E0

"Yorkfield XE" (45 millas náuticas)

Estos modelos cuentan con un multiplicador de reloj desbloqueado .
Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x
Tecnología de aceleración de E/S (Intel I/OAT) compatible con: QX9775
Intel VT-d compatible con: QX9650 ^[13]
Tamaño de la matriz : 2 × 107 mm ²
Pasos : C0, C1, E0
El QX9750 nunca se lanzó al mercado. Han aparecido muestras de ingeniería junto con afirmaciones de que Intel las regaló a sus empleados en algún momento de 2009. ^[14]^[15]^[16]

Core i (1.ª generación)

Campo de lynn

Características comunes:

Zócalo: LGA 1156 .
Todas las CPU admiten RAM DDR3 de doble canal a una velocidad de hasta 1333 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 1.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 45 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.

Campo de flores

Características comunes:

Zócalo: LGA 1366 .
Todas las CPU admiten RAM DDR3 de triple canal , a una velocidad de hasta 1066 MT/s .
Los carriles PCIe los proporciona el puente norte de la placa base en lugar de la CPU.
Todas las CPU cuentan con un bus QPI hacia el chipset ( puente norte ).
- La velocidad del bus es de 4,8 GT/s en todos los procesadores excepto en los modelos Extreme Edition, que funcionan a 6,4 GT/s.
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 45 nm .
Los procesadores Extreme Edition tienen un multiplicador desbloqueado y se pueden overclockear.

Clarkdale

Características comunes:

Zócalo: LGA 1156 .
Todas las CPU admiten RAM DDR3 de doble canal , a una velocidad de hasta 1333 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 1.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.

Ciudad del golfo

Características comunes:

Zócalo: LGA 1366 .
Todas las CPU admiten RAM DDR3 de triple canal , a una velocidad de hasta 1066 MT/s .
Los carriles PCIe los proporciona el puente norte de la placa base en lugar de la CPU.
Todas las CPU cuentan con un bus QPI hacia el chipset ( puente norte ).
- La velocidad del bus es de 4,8 GT/s en todos los procesadores excepto en los modelos con sufijo X, que funcionan a 6,4 GT/s.
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .
Los procesadores con sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (2.ª generación)

Puente Sandy-DT

Características comunes:

Zócalo: LGA 1155 .
Todas las CPU admiten RAM DDR3 de doble canal , a una velocidad de hasta 1333 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los procesadores integrados i3-2120, i5-2400 e i7-2600 están disponibles.
El Core i3-2102, una vez actualizado a través del Servicio de actualización de Intel, funciona a 3,6 GHz, tiene 3 MB de caché L3 y se reconoce como Core i3-2153.

Core i (3.ª generación)

Puente Ivy-DT

Características comunes:

Zócalo: LGA 1155 .
Todas las CPU admiten RAM DDR3 de doble canal , a una velocidad de hasta 1600 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe. Los modelos i5 y superiores lo admiten a velocidades PCIe 3.0 , mientras que los modelos i3 lo admiten a velocidades PCIe 2.0.
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los procesadores integrados i3-3220, i5-3550S y i7-3770 están disponibles.

Puente Sandy-E

Características comunes:

Zócalo: LGA 2011 .
Todas las CPU admiten RAM DDR3-1600 de cuatro canales.
Todos los modelos de CPU proporcionan 40 carriles de PCIe 2.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 32 nm .
Los procesadores con sufijo K y sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (cuarta generación)

Haswell-DT

Características comunes:

Zócalo: LGA 1150 .
Todas las CPU admiten RAM DDR3 de doble canal a una velocidad de hasta 1600 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los siguientes modelos están disponibles como procesadores integrados: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Haswell-H

Características comunes:

Zócalo: BGA 1364 (soldado).
Todas las CPU admiten RAM DDR3 de doble canal , a una velocidad de hasta 1600 MT/s .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Además del Smart Cache (caché L3), las CPU Haswell-H también contienen 128 MB de eDRAM que actúa como caché L4.
Proceso de fabricación: 22 nm .

Puente Ivy-E

Características comunes:

Zócalo: LGA 2011 .
Todas las CPU admiten RAM DDR3-1866 de cuatro canales.
Todos los modelos de CPU proporcionan 40 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los procesadores con sufijo K y sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (quinta generación)

Broadwell-H

Características comunes:

Zócalo: LGA 1150 para procesadores con sufijo C, BGA 1364 soldado para sufijo R.
Todas las CPU admiten RAM DDR3 de doble canal . Los procesadores con sufijo C lo admiten a velocidades de hasta 1600 MT/s , mientras que los de sufijo R lo admiten a 1866 MT/s.
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Además del Smart Cache (caché L3), las CPU Broadwell-H también contienen 128 MB de eDRAM que actúa como caché L4.
Proceso de fabricación: 14 nm .

Haswell-E

Características comunes:

Zócalo: LGA 2011-3 .
Todas las CPU admiten RAM DDR4-2133 de cuatro canales.
i7-5820K proporciona 28 carriles de PCIe 3.0 ; i7-5930K y 5960X proporcionan 40 carriles de PCIe 3.0.
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 22 nm .
Los procesadores con sufijo K y sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (sexta generación)

Lago Skylake-S

Características comunes:

Zócalo: LGA 1151 .
Todas las CPU admiten RAM DDR4-2133 o DDR3L -1600 de doble canal .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.

Lago Skylake-H

Características comunes:

Zócalo: BGA 1440 (soldado).
Todas las CPU admiten RAM DDR4-2133 o DDR3L -1600 de doble canal .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Además del Smart Cache (caché L3), las CPU Skylake-H también contienen 128 MB de eDRAM que actúa como caché L4.
Proceso de fabricación: 14 nm .

Broadwell-E

Características comunes:

Zócalo: LGA 2011-3 .
Todas las CPU admiten RAM DDR4-2400 de cuatro canales.
El i7-6800K proporciona 28 carriles de PCIe 3.0 ; todos los demás modelos proporcionan 40 carriles de PCIe 3.0.
Todas las CPU cuentan con un bus DMI 2.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K y sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (séptima generación)

Lago Kaby-S

Características comunes:

Zócalo: LGA 1151 .
Todas las CPU admiten RAM DDR4-2400 o DDR3L -1600 de doble canal .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.

Lago Skylake-X

Características comunes:

Zócalo: LGA 2066 .
Todas las CPU admiten memoria RAM DDR4 de cuatro canales a 2400 MHz. Los modelos i7-7820X y superiores admiten velocidades de hasta 2666 MT/s .
Los modelos i7 proporcionan 28 carriles de PCIe 3.0 ; los modelos i9 proporcionan 44 carriles de PCIe 3.0.
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo X y sufijo XE tienen un multiplicador desbloqueado y se pueden overclockear.

Lago Kaby-X

Características comunes:

Zócalo: LGA 2066 .
Todas las CPU admiten RAM DDR4-2666 de doble canal .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo X tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (octava generación)

Lago de café-S

Características comunes:

Zócalo: LGA 1151-2 .
Todas las CPU admiten memoria RAM DDR4 de doble canal a una velocidad de hasta 2400 MT/s . Los modelos i5 y superiores la admiten a una velocidad de hasta 2666 MT/s.
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (novena generación)

Lago de café-R

Características comunes:

Zócalo: LGA 1151-2 .
Todas las CPU admiten memoria RAM DDR4 de doble canal a una velocidad de hasta 2400 MT/s . Los modelos i5 y superiores la admiten a una velocidad de hasta 2666 MT/s.
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
El i9-9900KS tiene un reloj de refuerzo en todos los núcleos de 5,0 GHz.

Lago Skylake-X (9xxx)

Características comunes:

Zócalo: LGA 2066 .
Todas las CPU admiten RAM DDR4-2666 de cuatro canales.
Todos los modelos de CPU proporcionan 44 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo X y sufijo XE tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (décima generación)

Lago Cometa-S

Características comunes:

Zócalo: LGA 1200 .
Todas las CPU admiten memoria RAM DDR4 de doble canal a una velocidad de hasta 2666 MT/s . Los modelos i7 y superiores la admiten a una velocidad de hasta 2933 MT/s.
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 de 4 carriles hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los modelos i9 e i7 son compatibles con Turbo Boost 3.0, mientras que los i5 e i3 solo son compatibles con Turbo Boost 2.0. Las velocidades de reloj de turbo que se muestran corresponden a la versión de turbo boost más alta compatible con el procesador.

Comet Lake-S (actualización)

Se lanzó el mismo día que los procesadores de escritorio Rocket Lake-S de 11.ª generación.

Características comunes:

Zócalo: LGA 1200 .
Todas las CPU admiten RAM DDR4-2666 de doble canal .
Todos los modelos de CPU proporcionan 16 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 de 4 carriles hacia el chipset ( PCH ).
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Todos los modelos son compatibles con Turbo Boost 2.0.

Lago Cascade-X (10xxx)

Características comunes:

Zócalo: LGA 2066 .
Todas las CPU admiten RAM DDR4-2933 de cuatro canales.
Todos los modelos de CPU proporcionan 48 carriles de PCIe 3.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Sin gráficos integrados.
Caché L1 : 64 KB (32 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 256 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo X y sufijo XE tienen un multiplicador desbloqueado y se pueden overclockear.

Core i (11.ª generación)

Lago Rocket-S

Características comunes:

Zócalo: LGA 1200 .
Todas las CPU admiten memoria RAM DDR4 de doble canal de 3200 MHz. Los procesadores Core i9 K/KF permiten una relación de 1:1 entre DRAM y controlador de memoria de forma predeterminada en DDR4-3200, mientras que los Core i9 que no son K/KF y todas las demás CPU que se enumeran a continuación permiten una relación de 2:1 entre DRAM y controlador de memoria de forma predeterminada en DDR4-3200 y una relación de 1:1 de forma predeterminada en DDR4-2933. ^[20]
Todos los modelos de CPU proporcionan 20 carriles de PCIe 4.0 .
Todas las CPU cuentan con un bus DMI 3.0 de 8 carriles hacia el chipset ( PCH ).
Caché L1 : 80 KB (48 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 512 KB por núcleo.
Proceso de fabricación: 14 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los modelos i9 e i7 son compatibles con Turbo Boost 3.0, mientras que los i5 solo son compatibles con Turbo Boost 2.0. Las velocidades de reloj de turbo que se muestran corresponden a la versión de turbo boost más alta compatible con el procesador.

Lago del tigre-B

Características comunes:

Zócalo: BGA 1787 (soldado).
Todas las CPU admiten RAM DDR4-3200 de doble canal .
Todos los modelos de CPU proporcionan 20 carriles de PCIe 4.0 .
Todas las CPU cuentan con un bus DMI 3.0 al chipset ( PCH ).
Caché L1 : 80 KB (48 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2: 1,25 MB por núcleo.
Proceso de fabricación: 10 nm .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Estas CPU se vendieron únicamente a fabricantes de equipos originales (OEM).

Core i (12.ª generación)

Lago Alder-S

Características comunes:

Zócalo: LGA 1700 .
Todas las CPU admiten RAM DDR4 -3200 o DDR5 -4800 de doble canal .
Todas las CPU proporcionan 16 carriles de PCIe 5.0 y 4 carriles de PCIe 4.0 , pero el soporte puede variar según la placa base y los chipsets.
Todas las CPU cuentan con un bus DMI 4.0 de 8 carriles hacia el chipset ( PCH ).
Caché L1 :
- Núcleos P: 80 KB (48 KB de datos + 32 KB de instrucciones) por núcleo.
- Núcleos E: 96 KB (64 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2:
- Núcleos P: 1,25 MB por núcleo.
- E-cores: 2 MB por clúster de E-core (cada "clúster" contiene cuatro núcleos)
Proceso de fabricación: Intel 7 .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los modelos i9 e i7 son compatibles con Turbo Boost 3.0 en los núcleos P, mientras que el i5 solo es compatible con Turbo Boost 2.0. Las velocidades de reloj de turbo que se muestran corresponden a la versión de turbo boost más alta compatible con el procesador.

Core i (13.ª generación)

Lago Raptor-S

Características comunes:

Zócalo: LGA 1700 .
Todas las CPU admiten RAM DDR4 -3200 o DDR5 -5600 de doble canal .
Todas las CPU proporcionan 16 carriles de PCIe 5.0 y 4 carriles de PCIe 4.0 , pero el soporte puede variar según la placa base y los chipsets.
Todas las CPU cuentan con un bus DMI 4.0 de 8 carriles hacia el chipset ( PCH ).
Caché L1 :
- Núcleos P: 80 KB (48 KB de datos + 32 KB de instrucciones) por núcleo.
- Núcleos E: 96 KB (64 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2:
- Núcleos P: 2 MB por núcleo en modelos i5-13600K/KF y superiores, 1,25 MB por núcleo en modelos 13600 e inferiores.
- E-cores: 4 MB por clúster E-core en modelos i5-13600K/KF y superiores, 2 MB por clúster en modelos 13600 e inferiores (cada "clúster" contiene cuatro núcleos).
Proceso de fabricación: Intel 7 .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los modelos i9 e i7 son compatibles con Turbo Boost 3.0 en los núcleos P, mientras que el i5 solo es compatible con Turbo Boost 2.0. Las velocidades de reloj de turbo que se muestran corresponden a la versión de turbo boost más alta compatible con el procesador.

Core i (14.ª generación)

Actualización de Raptor Lake-S

Características comunes:

Zócalo: LGA 1700 .
Todas las CPU admiten RAM DDR4 -3200 o DDR5 -5600 de doble canal .
Todas las CPU proporcionan 16 carriles de PCIe 5.0 y 4 carriles de PCIe 4.0 , pero el soporte puede variar según la placa base y los chipsets.
Todas las CPU cuentan con un bus DMI 4.0 de 8 carriles hacia el chipset ( PCH ).
Caché L1 :
- Núcleos P: 80 KB (48 KB de datos + 32 KB de instrucciones) por núcleo.
- Núcleos E: 96 KB (64 KB de datos + 32 KB de instrucciones) por núcleo.
Caché L2:
- Núcleos P: 2 MB por núcleo.
- E-cores: 4 MB por clúster E-core (cada "clúster" contiene cuatro núcleos).
Proceso de fabricación: Intel 7 .
Los procesadores con sufijo K tienen un multiplicador desbloqueado y se pueden overclockear.
Los modelos i9 e i7 son compatibles con Turbo Boost 3.0 en los núcleos P, mientras que el i5 solo es compatible con Turbo Boost 2.0. Las velocidades de reloj de turbo que se muestran corresponden a la versión de turbo boost más alta compatible con el procesador.

Procesadores móviles

Centro

Yona

Núcleo 2

Interior de una antigua computadora portátil Sony VAIO (VGN-C140G)

"Merom-L" (65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Tamaño de la matriz : 81 mm ²
Pasos : A1

"Merom", "Merom-2M" (voltaje estándar, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2)
El modelo T7600G cuenta con un multiplicador de reloj desbloqueado. Solo se vende como OEM en la Dell XPS M1710.
Intel VT-x : compatible con T5500 (L2), T5600 y todos los T7xxx
Conmutación de frecuencia del bus frontal dinámico de Intel : compatible con versiones E1, G0, G2 y M0
Los procesadores Socket P pueden limitar el bus frontal (FSB) en cualquier valor entre 400 y 800 MT/s según sea necesario.
Tamaño de la matriz : 143 mm2 ⁽ Merom), 111 mm2 ⁽ Merom-2M)
Pasos : B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
Todos los modelos de stepping B2 lanzados en julio de 2006, stepping L2 lanzado en enero de 2007.

Ver también: Hay versiones del mismo núcleo Merom-2M con la mitad de la caché L2 deshabilitada bajo la marca Pentium Dual-Core .

"Merom" (bajo voltaje, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT)
Conmutación de frecuencia del bus frontal dinámico de Intel : compatible con versiones E1, G0 y G2
Tamaño de la matriz : 143 mm ²
Pasos : B2, E1, G0, G2

"Merom-2M" (voltaje ultrabajo, 65 nm)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x
Tamaño de la matriz : 111 mm ²
Pasos : L2, M0

"Merom XE" (65 nm)

Estos modelos cuentan con un multiplicador de reloj desbloqueado .

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
Los procesadores Merom XE admiten limitación dinámica del bus frontal entre 400 y 800 MT/s.
Tamaño de la matriz : 143 mm ²
Pasos : E1, G0

"Penryn-L" (45 millas náuticas)

Todos los modelos admiten: MMX , SSE , SSE2 , SSE3 , SSSE3 , SSE4.1 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (una implementación de NX bit ), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Los procesadores Socket P pueden limitar el bus frontal (FSB) en cualquier valor entre 400 y 800 MT/s según sea necesario.
Tamaño de la matriz : 82 mm ²
228 millones de transistores
Tamaño del paquete: 22 mm × 22 mm
Pasos : M0, R0

"Penryn" (específico para iMac de Apple, 45 nm)

Tamaño de la matriz : 107 mm ²
El iMac de 20" de 2008 utilizaba las CPU E8135 y E8335 a una frecuencia de reloj inferior a la especificada, lo que explica por qué se utiliza el mismo modelo a frecuencias diferentes. Esta lista muestra las frecuencias utilizadas por Apple.
Pasos : C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)^[28]
T6570,^[29] T6670, all T8xxx and T9xxx models support Intel VT-x
All T9xxx models support Trusted Execution Technology (TXT)
T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)^[28]

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),^[30]^[31]^[32] Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Select Apple subsets of P7000 series processors support Intel VT-x.^[33]
Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Package size: 35 mm × 35 mm
Transistors: 410 million ^[34]
Steppings: (Core microarchitecture 45nm steppings)
- C0, E0 (Penryn)
- M0, R0 (Penryn-3M)
- stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
- stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: M0, R0

"Penryn XE" (45 nm)

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
Die size: 107 mm²
Steppings: C0, E0

"Penryn QC" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Die size: 2 × 107 mm²
Steppings: E0

"Penryn QC XE" (45 nm)

This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Package size: 35 mm × 35 mm
Die size: 2 × 107 mm²
Steppings: E0

Core i (1st gen)

Clarksfield

Common features:

Socket: G1.
All the CPUs support dual-channel DDR3-1333 RAM.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
XM-suffix processors have an unlocked multiplier and can be overclocked.

Arrandale

Common features:

Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Core i (2nd gen)

Sandy Bridge-M

Common features:

Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (3rd gen)

Ivy Bridge

Common features:

Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
XM-suffix models have an unlocked multiplier and can be overclocked.

Core i (4th gen)

Haswell-MB

Common features:

Socket: G3.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
MX-suffix models have an unlocked multiplier and can be overclocked.

Haswell-ULT

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Haswell-ULX

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Haswell-H

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 22 nm.
i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.

Core i (5th gen)

Broadwell-U

Common features:

Socket: BGA 1168.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Broadwell-H

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Core M (5th gen)

Broadwell-Y

Common features:

Socket: BGA 1234.
All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 12 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (6th gen)

Skylake-U

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Skylake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Core M (6th gen)

Skylake-Y

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (7th gen)

Kaby Lake-U

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Kaby Lake-Y

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core M (7th gen)

Kaby Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (8th gen)

Coffee Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Coffee Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Coffee Lake-B

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake Refresh

Common features:

Socket: BGA 1356.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 12 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake-G

Common features:

Socket: BGA 2270.
All the CPUs support dual-channel DDR4-2400 RAM.
All CPU models provide 8 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Amber Lake-Y

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Whiskey Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Cannon Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 10 nm.

Core M (8th gen)

Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

Socket: BGA 1515.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (9th gen)

Coffee Lake-H (refresh)

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Core i (10th gen)

Comet Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Comet Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Ice Lake-U

Common features:

Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Ice Lake-Y

Common features:

Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
PCIe 3.0 support.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 10 nm.

Amber Lake-Y (10xxx)

Common features:

Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
All CPU models provide 10 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (11th gen)

Tiger Lake-UP3

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-UP4

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel LPDDR4X-4266 RAM.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Tiger Lake-H

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Tiger Lake-H35

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.

Core i (12th gen)

Alder Lake-U

Common features:

Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Alder Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Alder Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.

Alder Lake-HX

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i9 models have unlocked multipliers, allowing them to be overclocked.

Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

Socket: BGA 1264.
All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
All CPU models provide 9 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: 2 MB per cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Core i (13th gen)

Raptor Lake-U

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Raptor Lake-PX

Common features:

Socket: BGA 1792.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-HX

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.^[41]
i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Core i (14th gen)

Raptor Lake-HX Refresh

Common features:

Socket: BGA 1964.
All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
All models support CPU, iGPU, and memory overclocking.
i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.

Core / Core Ultra 3/5/7/9 (Series 1)

Raptor Lake-U Refresh

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Xe-LP architecture.
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.

Meteor Lake-U

Common features:

Socket: BGA 2049.
All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.

Meteor Lake-H

Common features:

Socket: BGA 2049.
All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.

Core Ultra 5/7/9 (Series 2)

Lunar Lake

Embedded processors

Core i (1st gen)

Arrandale

Common features:

Socket: BGA 1288.
All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:

Core i7-2600
Core i5-2400
Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features:

Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Gladden

Common features:

Socket: BGA 1284.
All the CPUs support dual-channel DDR3-1333 RAM.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:

Core i7-3770
Core i5-3550S
Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features:

Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.

Gladden

Common features:

Socket: BGA 1284.
All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
All CPU models provide 20 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

Core i (4th gen)

Haswell-DT

Common features:

Socket: LGA 1150.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.

The following models from the Haswell-DT desktop range are also available as embedded processors:

Core i7-4790S
Core i7-4770S
Core i5-4590S
Core i5-4590T
Core i5-4570S
Core i3-4360
Core i3-4350T
Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 22 nm.

Core i (5th gen)

Broadwell-H

Common features:

Socket: BGA 1364.
All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Core i (6th gen)

Skylake-S

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Skylake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
Fabrication process: 14 nm.

Core i (7th gen)

Kaby Lake-S

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Kaby Lake-H

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2400 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (8th gen)

Whiskey Lake-U

Common features:

Socket: BGA 1528.
All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (9th gen)

Coffee Lake-R

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Coffee Lake-H (refresh)

Common features:

Socket: BGA 1440.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.

Core i (10th gen)

Comet Lake-S

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
i9-10900E features Thermal Velocity Boost.

Core i (11th gen)

Tiger Lake-UP3

Common features:

Socket: BGA 1449.
All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
-GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.

Tiger Lake-H

Common features:

Socket: BGA 1598.
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Minimum operating temperature: 0°C.

Core i (12th gen)

Alder Lake-S

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.
Turbo Boost version is 2.0.

Alder Lake-U

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Alder Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Alder Lake-PS

Common features:

Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Alder Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Core i (13th gen)

Raptor Lake-S

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
- E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
Turbo Boost version is 2.0.

Raptor Lake-U

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-P

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Raptor Lake-H

Common features:

Socket: BGA 1744.
All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
Fabrication process: Intel 7.

Core / Core Ultra 3/5/7/9 (Series 1)

Meteor Lake-PS

Common features:

Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
All the CPUs support dual-channel DDR5-5600 RAM.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
Includes integrated graphics based on Alchemist architecture.
L1 cache:
- P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
Fabrication process: Intel 4 (compute tile).
Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.

References

^ a b "Advanced Technologies". Intel Corporation. Retrieved February 12, 2010.
^ a b Less power greedy Core 2 Duo Archived February 16, 2012, at the Wayback Machine, BeHardware November 15, 2006
^ "Details regarding Conroe models". The Inquirer. February 6, 2006. Archived from the original on December 31, 2006.
^ DailyTech article on upcoming Core 2 Extreme CPUs Archived 2006-06-15 at the Wayback Machine, May 31, 2006
^ "QTOM (Intel Core 2 Duo 3.2 GHZ)". Archived from the original on May 5, 2023. Retrieved May 1, 2023.
^ "forums :: View topic – Need help with identifying a Core 2 (TM) CPU (ES) processor". Cpu-world.com. Archived from the original on May 7, 2023. Retrieved April 4, 2022.
^ Intel Core 2 Quad Announced Internally Archived 2006-09-21 at the Wayback Machine, DailyTech, September 19, 2006
^ Intel Hard-Launches Three New Quad-core Processors Archived 2016-04-05 at the Wayback Machine, DailyTech, January 7, 2007
^ "SL9UN (Intel Core 2 Quad Q6400)". CPU-World. Archived from the original on May 4, 2023. Retrieved October 27, 2018.
^ "Kentsfield" to Debut at 2.66 GHz Archived 2006-10-21 at the Wayback Machine, DailyTech, August 16, 2006
^ "Intel Core 2 Duo E8290 – EU80570PJ0736MN". Archived from the original on June 5, 2022. Retrieved May 1, 2023.
^ "Intel Launches Core 2 Duo E8700". January 26, 2009.
^ "Intel Core2 Quad Processor Q9650 (12M Cache, 3.00 GHz, 1333 MHz FSB) Product Specifications". ark.intel.com. Archived from the original on June 26, 2019. Retrieved June 26, 2019.
^ "Qx9750!!! :)". guru3D Forums. Archived from the original on May 1, 2023. Retrieved May 1, 2023.
^ "Building around my new QX-9750". AnandTech Forums: Technology, Hardware, Software, and Deals. May 27, 2009. Archived from the original on May 1, 2023. Retrieved May 1, 2023.
^ "My new chip WOO HOO!!!".
^ Intel Corporation (November 11, 2007). "Intel's Fundamental Advance in Transistor Design Extends Moore's Law, Computing Performance". Archived from the original on May 7, 2023. Retrieved May 1, 2023.
^ "Intel Core 2 Extreme QX9750 AT80569XJ087NL". Archived from the original on March 16, 2021. Retrieved May 1, 2023.
^ Cutress, Ian (October 28, 2019). "The Intel Core i9-9990XE Review: All 14 Cores at 5.0 GHz". www.anandtech.com. Archived from the original on February 8, 2023. Retrieved May 20, 2023.
^ Cutress, Ian (March 16, 2021). "Intel Launches Rocket Lake 11th Gen Core i9, Core i7, and Core i5". AnandTech. Archived from the original on December 19, 2021. Retrieved March 17, 2021.
^ "Intel Core i5-12490F is China exclusive 6-core Alder Lake desktop CPU with 20MB L3 cache". VideoCardz.com. January 5, 2022. Archived from the original on February 28, 2022. Retrieved July 23, 2023.
^ "SLA4C (Intel Core 2 Duo T5850)". CPU-World. Archived from the original on May 3, 2023. Retrieved October 27, 2018.
^ "SLB6D (Intel Core 2 Duo T5900)". CPU-World. Archived from the original on May 5, 2023. Retrieved October 27, 2018.
^ "SL9U5 (Intel Core 2 Duo T7600G)". CPU-World. Archived from the original on May 6, 2023. Retrieved October 27, 2018.
^ Shah, Agam (February 11, 2008). "Intel develops processor similar to MacBook Air chip". InfoWorld. Archived from the original on October 28, 2018. Retrieved October 27, 2018.
^ a b "Support for Intel Processors". Intel. Archived from the original on June 23, 2019. Retrieved June 26, 2019.
^ Shimpi, Anand Lai (January 17, 2008). "The MacBook Air CPU Mystery: More Details Revealed". AnandTech. Archived from the original on January 5, 2010. Retrieved October 27, 2018.
^ a b "Intel Core2 Duo Processor T6400 (2M Cache, 2.00 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on February 12, 2009. Retrieved February 6, 2009.
^ "Intel Core2 Duo Processor T6570 (2M Cache, 2.10 GHz, 800 MHz FSB)". Intel Corporation. Archived from the original on July 4, 2011. Retrieved March 20, 2010.
^ "Intel® Core™2 Duo Mobile Processor P7350 – SLB53". Archived from the original on February 5, 2009. Retrieved February 9, 2009.
^ "Intel® Core™2 Duo Mobile Processor P7450 – SLB54". Archived from the original on May 16, 2009. Retrieved May 2, 2009.
^ "Intel product specifications". ark.intel.com. Archived from the original on July 4, 2011. Retrieved June 26, 2019.
^ Eric Tung (March 13, 2009). "Re: Does VMware Fusion require a CPU supporting Intel VT-x?". Archived from the original on July 19, 2009. Retrieved April 18, 2009.
^ "Tech ARP – Mobile CPU Comparison Guide Rev. 12.3". Techarp.com. Archived from the original on September 10, 2015. Retrieved December 18, 2015.
^ "[ Hardware.Info ] – Intel Core 2 Duo P8400 [BX80577P8400]". September 2, 2008. Archived from the original on September 2, 2008. Retrieved June 26, 2019.
^ "[ Hardware.Info ] – Intel Core 2 Duo P8600 [BX80577P8600]". February 8, 2009. Archived from the original on February 8, 2009. Retrieved June 26, 2019.
^ "CPU-Upgrade: Intel Core i3-2332M CPU". cpu-upgrade.com. Archived from the original on September 18, 2017. Retrieved October 19, 2023.
^ "CPU-Upgrade: Intel Core i3-2308M CPU". cpu-upgrade.com. Archived from the original on June 28, 2016. Retrieved October 19, 2023.
^ "CPU-Upgrade: Intel Core i3-4010M CPU". cpu-upgrade.com. Retrieved October 21, 2023.
^ Pirzada, Usman (August 1, 2019). "Intel Launches 10th Generation 10nm 'Ice Lake' Mobility Processors - Led By Core i7 1068G7 Flagship With 3.6 GHZ All Core Boost". Wccftech. Archived from the original on May 1, 2023. Retrieved February 7, 2024.
^ Intel Corporation. "13th Gen Intel Core Mobile Processor Product Brief". Intel. Archived from the original on May 11, 2023. Retrieved January 7, 2023.

ATI provides pointer to Intel's 'Allendale', May 23, 2006
Rumoured prices and specifications for Intel Core 2, May 30, 2006
TGDaily indicates leaked release dates,^{[permanent dead link]} July 24, 2006
Intel to unveil five Merom CPUs in July, paper says(subscription required) as re-reported by DigiTimes, July 17, 2006
Intel Unveils World's Best Processor,^{[dead link]} July 27, 2006
Intel Takes Popular Laptops to 'Extreme' with First-Ever Extreme Edition Mobile Processor; Adds New Desktop Chip,^{[dead link]} July 16, 2007
CORE 2 DUO 1333 MHZ STEPPING Archived May 20, 2022, at the Wayback Machine, July 18, 2007

External links

Search MDDS Database
Intel ARK Database
SSPEC/QDF Reference (Intel)
Intel® Processor Names, Numbers and Generation List
Intel CPU Transition Roadmap 2008–2013
Intel Desktop CPU Roadmap 2004–2011
Intel Core Solo mobile processor product order code table
Intel Core Duo mobile processor product order code table
Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet
Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update
Intel Core 2 Duo Processors Technical Documents
Intel Core i3 desktop processor product order code table
Intel Core i3 mobile processor product order code table
Tabla de códigos de pedido de productos de procesadores de escritorio Intel Core i5
Tabla de códigos de pedido de productos de procesadores móviles Intel Core i5
Tabla de códigos de pedido de productos de procesadores de escritorio Intel Core i7
Tabla de códigos de pedido de productos de procesadores móviles Intel Core i7
Tabla de códigos de pedido de productos del procesador de escritorio Intel Core i7 Extreme Edition
Tabla de códigos de pedido de productos del procesador móvil Intel Core i7 Extreme Edition
Página web del procesador Intel Core i7
Página web del procesador Intel Core i7 Extreme Edition
Números de procesadores Core i7 de Intel
Números de procesadores Core i7 Extreme Edition de Intel
Intel Corporation – Lista de precios de procesadores
Intel Corporation – Lista de precios de procesadores
Procesadores Intel Core serie X