The latest badge promoting the Intel Core branding The following is a list of Intel Core processors . This includes Intel 's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture , as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7), Core 3-, Core 5-, and Core 7-branded processors.
Desktop processors
Core 2 Front side of an Intel Core 2 Duo T7500 Processor
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2) a Die size: 111 mm2 Steppings : L2b , M0c , G0d
^c M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.
^d G0 Stepping which makes it a Conroe CPU.
^a Trusted Execution Technology (TXT).[1]
^b L2 Stepping , and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.[2]
^c M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2) a All models support: Intel VT-x All E6x50 models support: Intel VT-x , Trusted Execution Technology (TXT) Die size: 143 mm2 Transistor count : 291 millionSteppings : B2, G0^a Trusted Execution Technology (TXT).[1]
^b L2 Stepping , and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.[2]
^c M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Die size: 111 mm2 (Conroe) Steppings : ?
[3] [4]
These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Die size: 143 mm2 Steppings : B1, B2 The X6900 was never publicly released.
[7] [8]
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x Die size: 2 ×143 mm2 Steppings : B3, G0
[10]
These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x Die size: 2 ×143 mm2 Steppings : B3, G0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2) Die size: 82 mm2 Transistor Count: 230 million Steppings : M0, R0 Models with a part number ending in "ML" instead of "M" support Intel VT-x
All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology ), Intel VT-x [a] , Intel VT-d [b] , Trusted Execution Technology (TXT) Die size: 107 mm2 Transistor Count: 410 million Steppings : C0, E0 a Note: The E8190 and E8290 do not support Intel VT-d.
Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM,[12] but none was offered in retail PCs.
See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x [a] , Intel VT-d [b] , Trusted Execution Technology (TXT) [c] Die size: 2 × 82 mm2 Steppings : M0, M1, R0 All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled. a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.
b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.
c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Intel VT-d , Trusted Execution Technology (TXT) Die size: 2 × 107 mm2 The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC. Steppings : C0, C1, E0
These models feature an unlocked clock multiplier All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x I/O Acceleration Technology (Intel I/OAT) supported by: QX9775 Intel VT-d supported by: QX9650[13] Die size: 2 × 107 mm2 Steppings : C0, C1, E0 The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.[14] [15] [16]
Core i (1st gen)
Lynnfield Common features:
Socket: LGA 1156 . All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 1.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 45 nm . K-suffix processors have an unlocked multiplier and can be overclocked.
Bloomfield Common features:
Socket: LGA 1366 . All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed. PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU. All CPUs feature a QPI bus to the chipset (northbridge ).Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s. No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 45 nm . Extreme Edition processors have an unlocked multiplier and can be overclocked.
Clarkdale Intel i3 540 CPU die shot (Westmere) Intel i3 540 CPU and IGPU Dies Common features:
Socket: LGA 1156 . All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 1.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm . K-suffix processors have an unlocked multiplier and can be overclocked.
Gulftown Common features:
Socket: LGA 1366 . All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed. PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU. All CPUs feature a QPI bus to the chipset (northbridge ).Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s. No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm . X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (2nd gen)
Sandy Bridge-DT Common features:
Intel i5 2500 die shot Socket: LGA 1155 . All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm . K-suffix processors have an unlocked multiplier and can be overclocked. i3-2120, i5-2400, and i7-2600 are available as embedded processors. The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.
Core i (3rd gen)
Ivy Bridge-DT Common features:
Socket: LGA 1155 . All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . K-suffix processors have an unlocked multiplier and can be overclocked. i3-3220, i5-3550S and i7-3770 are available as embedded processors.
Sandy Bridge-E Common features:
Socket: LGA 2011 . All the CPUs support quad-channel DDR3-1600 RAM. All CPU models provide 40 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm . K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (4th gen)
Haswell-DT Intel i3 4130, Haswell 22nm die shot Common features:
Socket: LGA 1150 . All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . K-suffix processors have an unlocked multiplier and can be overclocked. The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.
Haswell-H Common features:
Socket: BGA 1364 (soldered). All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache. Fabrication process: 22 nm .
Ivy Bridge-E Common features:
Socket: LGA 2011 . All the CPUs support quad-channel DDR3-1866 RAM. All CPU models provide 40 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (5th gen)
Broadwell-H Common features:
Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix. All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache. Fabrication process: 14 nm .
Haswell-E Common features:
Socket: LGA 2011-3 . All the CPUs support quad-channel DDR4-2133 RAM. i7-5820K provides 28 lanes of PCIe 3.0 ; i7-5930K and 5960X provide 40 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (6th gen)
Skylake-S Common features:
Socket: LGA 1151 . All the CPUs support dual-channel DDR4-2133 or DDR3L -1600 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked.
Skylake-H Common features:
Socket: BGA 1440 (soldered). All the CPUs support dual-channel DDR4-2133 or DDR3L -1600 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache. Fabrication process: 14 nm .
Broadwell-E Common features:
Socket: LGA 2011-3 . All the CPUs support quad-channel DDR4-2400 RAM. i7-6800K provides 28 lanes of PCIe 3.0 ; all other models provide 40 lanes of PCIe 3.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (7th gen)
Kaby Lake-S Common features:
Socket: LGA 1151 . All the CPUs support dual-channel DDR4-2400 or DDR3L -1600 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked.
Skylake-X Common features:
Socket: LGA 2066 . All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds. i7 models provide 28 lanes of PCIe 3.0 ; i9 models provide 44 lanes of PCIe 3.0. All CPUs feature a DMI 3.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Kaby Lake-X Common features:
Socket: LGA 2066 . All the CPUs support dual-channel DDR4-2666 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . X-suffix processors have an unlocked multiplier and can be overclocked.
Core i (8th gen)
Coffee Lake-S Common features:
Socket: LGA 1151-2 . All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked.
Core i (9th gen)
Coffee Lake-R Common features:
Socket: LGA 1151-2 . All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked. i9-9900KS has all-core boost clock of 5.0 GHz.
Common features:
Socket: LGA 2066 . All the CPUs support quad-channel DDR4-2666 RAM. All CPU models provide 44 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Core i (10th gen)
Comet Lake-S Common features:
Socket: LGA 1200 . All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked. i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Released on the same day as the 11th gen Rocket Lake-S desktop processors.
Common features:
Socket: LGA 1200 . All the CPUs support dual-channel DDR4-2666 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . All models support Turbo Boost 2.0.
Common features:
Socket: LGA 2066 . All the CPUs support quad-channel DDR4-2933 RAM. All CPU models provide 48 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Core i (11th gen)
Rocket Lake-S Common features:
Socket: LGA 1200 . All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.[20] All CPU models provide 20 lanes of PCIe 4.0 . All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 512 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier and can be overclocked. i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Tiger Lake-B Common features:
Socket: BGA 1787 (soldered). All the CPUs support dual-channel DDR4-3200 RAM. All CPU models provide 20 lanes of PCIe 4.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . K-suffix processors have an unlocked multiplier and can be overclocked. These CPUs were sold to OEMs only.
Core i (12th gen)
Alder Lake-S Common features:
Socket: LGA 1700 . All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM. All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0 , but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores) Fabrication process: Intel 7 . K-suffix processors have an unlocked multiplier and can be overclocked. i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Core i (13th gen)
Raptor Lake-S Common features:
Socket: LGA 1700 . All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM. All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0 , but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models. E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores). Fabrication process: Intel 7 . K-suffix processors have an unlocked multiplier and can be overclocked. i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Core i (14th gen)
Raptor Lake-S Refresh Common features:
Socket: LGA 1700 . All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM. All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0 , but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . K-suffix processors have an unlocked multiplier and can be overclocked. i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Mobile processors
Core
Yonah
Core 2 Inside of old Sony VAIO laptop (VGN-C140G)
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Die size: 81 mm2 Steppings : A1
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2) Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710. Intel VT-x Intel Dynamic Front Side Bus Frequency Switching : Supported by E1, G0, G2, M0 Steppings Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed. Die size: 143 mm2 (Merom), 111 mm2 (Merom-2M) Steppings : B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)All models of stepping B2 released in July 2006, stepping L2 released in January 2007. See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Intel Dynamic Front Side Bus Frequency Switching : Supported by E1, G0, G2 Steppings Die size: 143 mm2 Steppings : B2, E1, G0, G2
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x Die size: 111 mm2 Steppings : L2, M0
These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s. Die size: 143 mm2 Steppings : E1, G0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.Die size: 82 mm2 228 million transistors Package size: 22 mm × 22 mm Steppings : M0, R0
Die size: 107 mm2 The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple. Steppings : C0, E0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA) [28] T6570,[29] T6670, all T8xxx and T9xxx models support Intel VT-x All T9xxx models support Trusted Execution Technology (TXT) T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled. Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.
Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450),[30] [31] [32] Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Select Apple subsets of P7000 series processors support Intel VT-x.[33] Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s. Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M) Package size: 35 mm × 35 mm Transistors: 410 million [34] Steppings : (Core microarchitecture 45nm steppings )C0, E0 (Penryn)M0, R0 (Penryn-3M)stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh ) platform stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina ) platform
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Die size: 107 mm2 Package size: 22 mm × 22 mm Steppings : C0, E0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA) Die size: 107 mm2 Package size: 22 mm × 22 mm Steppings : C0, E0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA) Die size: 107 mm2 Package size: 22 mm × 22 mm Steppings : M0, R0
These models feature an unlocked clock multiplier All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s. Die size: 107 mm2 Steppings : C0, E0
All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed. Die size: 2 × 107 mm2 Steppings : E0
This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor. All models support: MMX, SSE, SSE2, SSE3, SSSE3 , SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64 , XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x , Trusted Execution Technology (TXT) Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed. Package size: 35 mm × 35 mm Die size: 2 × 107 mm2 Steppings : E0
Core i (1st gen)
Clarksfield Common features:
Socket: G1. All the CPUs support dual-channel DDR3-1333 RAM. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 1.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 45 nm . XM-suffix processors have an unlocked multiplier and can be overclocked.
Arrandale Common features:
Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1 . All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 1.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm .
Core i (2nd gen)
Sandy Bridge-M Common features:
Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models). All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm . XM-suffix models have an unlocked multiplier and can be overclocked.
Core i (3rd gen)
Ivy Bridge Intel i5 3230M die shot Common features:
Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models). All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . XM-suffix models have an unlocked multiplier and can be overclocked.
Core i (4th gen)
Haswell-MB Common features:
Socket: G3. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . MX-suffix models have an unlocked multiplier and can be overclocked.
Haswell-ULT Common features:
Socket: BGA 1168. All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm .
Haswell-ULX Common features:
Socket: BGA 1168. All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 12 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm .
Haswell-H Common features:
Socket: BGA 1364. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 22 nm . i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.
Core i (5th gen)
Broadwell-U Common features:
Socket: BGA 1168. All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed. All CPU models provide 12 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Broadwell-H Common features:
Socket: BGA 1364. All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 14 nm .
Core M (5th gen)
Broadwell-Y Common features:
Socket: BGA 1234. All the CPUs support dual-channel DDR3L , DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 12 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (6th gen)
Skylake-U Common features:
Socket: BGA 1356. All the CPUs support dual-channel DDR4-2133, DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 12 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Skylake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2133, DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Core M (6th gen)
Skylake-Y Common features:
Socket: BGA 1515. All the CPUs support dual-channel DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (7th gen)
Kaby Lake-U Common features:
Socket: BGA 1356. All the CPUs support dual-channel DDR4-2133, DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 12 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Kaby Lake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2400, DDR3L -1600 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Kaby Lake-Y Common features:
Socket: BGA 1515. All the CPUs support dual-channel LPDDR3 -1866 or DDR3L -1600 RAM. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core M (7th gen)
Kaby Lake-Y Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
Common features:
Socket: BGA 1515. All the CPUs support dual-channel DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (8th gen)
Coffee Lake-U Common features:
Socket: BGA 1528. All the CPUs support dual-channel DDR4-2400 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Coffee Lake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Coffee Lake-B Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2666 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Kaby Lake Refresh Common features:
Socket: BGA 1356. All the CPUs support dual-channel DDR4-2400 or LPDDR3 -2133 RAM. All CPU models provide 12 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Kaby Lake-G Common features:
Socket: BGA 2270. All the CPUs support dual-channel DDR4-2400 RAM. All CPU models provide 8 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Amber Lake-Y Common features:
Socket: BGA 1515. All the CPUs support dual-channel LPDDR3 -1866 or DDR3L -1600 RAM. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Whiskey Lake-U Common features:
Socket: BGA 1528. All the CPUs support dual-channel DDR4-2400 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Cannon Lake-U Common features:
Socket: BGA 1528. All the CPUs support dual-channel DDR4-2400 or LPDDR4 (x)-2400 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 10 nm .
Core M (8th gen)
Amber Lake-Y Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
Common features:
Socket: BGA 1515. All the CPUs support dual-channel DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (9th gen)
Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2666 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Core i (10th gen)
Comet Lake-U Common features:
Socket: BGA 1528. All the CPUs support dual-channel DDR4-2666, LPDDR4 -2933 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Comet Lake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Ice Lake-U Common features:
Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package. All the CPUs support dual-channel DDR4-3200 or LPDDR4 -3733 RAM. PCIe 3.0 support.All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 512 KB per core. Fabrication process: 10 nm .
Ice Lake-Y Common features:
Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package. All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed. PCIe 3.0 support.All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 512 KB per core. Fabrication process: 10 nm .
Common features:
Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name. All the CPUs support dual-channel DDR3L -1600 or LPDDR3 -1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed. All CPU models provide 10 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (11th gen)
Tiger Lake-UP3 Common features:
Socket: BGA 1449. All the CPUs support dual-channel DDR4-3200 or LPDDR4X -3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed. All CPU models provide 4 lanes of PCIe 4.0 , in addition to PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Tiger Lake-UP4 Common features:
Socket: BGA 1598. All the CPUs support dual-channel LPDDR4X -4266 RAM. All CPU models provide 4 lanes of PCIe 4.0 , in addition to PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Tiger Lake-H Common features:
Socket: BGA 1598. All the CPUs support dual-channel DDR4-3200 RAM. All CPU models provide 20 lanes of PCIe 4.0 , in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen. K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Tiger Lake-H35 Common features:
Socket: BGA 1449. All the CPUs support dual-channel DDR4-3200 or LPDDR4X -4266 RAM. PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Core i (12th gen)
Alder Lake-U Common features:
Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U). All the CPUs support dual-channel LPDDR5 -5200 or LPDDR4X -4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition. ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Alder Lake-P Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5 -5200 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . The following models are available with IPU (image processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Alder Lake-H Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5 -5200 or LPDDR4X -4266 RAM. All CPU models provide 16 lanes of PCIe 4.0 , in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Alder Lake-HX Common features:
Socket: BGA 1964. All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . The i9 models have unlocked multipliers, allowing them to be overclocked.
Alder Lake-N These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.
Common features:
Socket: BGA 1264. All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5 -4800 RAM. All CPU models provide 9 lanes of PCIe 3.0 . All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache : 96 KB (64 KB data + 32 KB instructions) per core. L2 cache: 2 MB per cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Core i (13th gen)
Raptor Lake-U Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . The i3-1315U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Raptor Lake-P Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Raptor Lake-H Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . K-suffix processors have an unlocked multiplier, allowing it to be overclocked. The i5-13500H is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Raptor Lake-PX Common features:
Socket: BGA 1792. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Raptor Lake-HX Common features:
Socket: BGA 1964. All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed. All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . All models support CPU, iGPU, and memory overclocking.[41] i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Core i (14th gen)
Raptor Lake-HX Refresh Common features:
Socket: BGA 1964. All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM. All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . All models support CPU, iGPU, and memory overclocking. i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Core / Core Ultra 3/5/7/9 (Series 1)
Raptor Lake-U Refresh Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). Includes integrated graphics based on Xe-LP architecture. L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . The Core 3 100U is available with IPU (image processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Meteor Lake-U Common features:
Socket: BGA 2049. All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X -7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400. All CPU models provide 20 lanes of PCIe 4.0 . All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). Includes integrated graphics based on Alchemist architecture. L1 cache :P-cores: 112 KB (48 KB data + 64 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache. Fabrication process: Intel 4 (compute tile). Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.
Meteor Lake-H Common features:
Socket: BGA 2049. All the CPUs support dual-channel DDR5-5600 or LPDDR5X -7466 RAM. All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). Includes integrated graphics based on Alchemist architecture. L1 cache :P-cores: 112 KB (48 KB data + 64 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache. Fabrication process: Intel 4 (compute tile). Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.
Core Ultra 5/7/9 (Series 2)
Lunar Lake
Embedded processors
Core i (1st gen)
Arrandale Common features:
Socket: BGA 1288. All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 1.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm .
Core i (2nd gen)
Sandy Bridge-DT The following models from the Sandy Bridge desktop range are available as embedded processors:
Core i7-2600 Core i5-2400 Core i3-2120 See section Desktop processors § Sandy Bridge-DT for full info.
Sandy Bridge-M Common features:
Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models). All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm .
Gladden Common features:
Socket: BGA 1284. All the CPUs support dual-channel DDR3-1333 RAM. All CPU models provide 16 lanes of PCIe 2.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm .
Core i (3rd gen)
Ivy Bridge-DT The following models from the Ivy Bridge desktop range are available as embedded processors:
Core i7-3770 Core i5-3550S Core i3-3220 See section Desktop processors § Ivy Bridge-DT for full info.
Ivy Bridge-M Common features:
Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME). All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed. i7 models provide 16 lanes of PCIe 3.0 , while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0. All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 32 nm .
Gladden Common features:
Socket: BGA 1284. All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM. All CPU models provide 20 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). No integrated graphics. L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm .
Core i (4th gen)
Haswell-DT Common features:
Socket: LGA 1150 . All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 22 nm . The following models from the Haswell-DT desktop range are also available as embedded processors:
Core i7-4790S Core i7-4770S Core i5-4590S Core i5-4590T Core i5-4570S Core i3-4360 Core i3-4350T Core i3-4330 See section Desktop processors § Haswell-DT for full info.
Haswell-H Common features:
Socket: BGA 1364. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 22 nm .
Core i (5th gen)
Broadwell-H Common features:
Socket: BGA 1364. All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 2.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 14 nm .
Core i (6th gen)
Skylake-S Common features:
Socket: LGA 1151 . All the CPUs support dual-channel DDR4-2133 or DDR3L -1600 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Skylake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2133, DDR3L -1600 or LPDDR3 -1866 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM , acting as L4 cache. Fabrication process: 14 nm .
Core i (7th gen)
Kaby Lake-S Common features:
Socket: LGA 1151 . All the CPUs support dual-channel DDR4-2400 or DDR3L -1600 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Kaby Lake-H Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2400 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (8th gen)
Whiskey Lake-U Common features:
Socket: BGA 1528. All the CPUs support dual-channel DDR4-2400 or LPDDR3 -2133 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (9th gen)
Coffee Lake-R Common features:
Socket: LGA 1151-2 . All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Common features:
Socket: BGA 1440. All the CPUs support dual-channel DDR4-2666 RAM. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm .
Core i (10th gen)
Comet Lake-S Common features:
Socket: LGA 1200 . All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds. All CPU models provide 16 lanes of PCIe 3.0 . All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH). L1 cache : 64 KB (32 KB data + 32 KB instructions) per core. L2 cache: 256 KB per core. Fabrication process: 14 nm . i9-10900E features Thermal Velocity Boost.
Core i (11th gen)
Tiger Lake-UP3 Common features:
Socket: BGA 1449. All the CPUs support dual-channel DDR4-3200 or LPDDR4X -3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed. All CPU models provide 4 lanes of PCIe 4.0 , in addition to PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen. -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.
Tiger Lake-H Common features:
Socket: BGA 1598. All the CPUs support dual-channel DDR4-3200 RAM. All CPU models provide 20 lanes of PCIe 4.0 , in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 3.0 bus to the chipset (PCH). L1 cache : 80 KB (48 KB data + 32 KB instructions) per core. L2 cache: 1.25 MB per core. Fabrication process: 10 nm . The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen. Minimum operating temperature: 0°C.
Core i (12th gen)
Alder Lake-S Common features:
Socket: LGA 1700 . All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0 , but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 . Turbo Boost version is 2.0.
Alder Lake-U Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5 -5200 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Alder Lake-P Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5 -5200 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Alder Lake-PS Common features:
Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors. All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Alder Lake-H Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5 -5200 or LPDDR4X -4266 RAM. All CPU models provide 16 lanes of PCIe 4.0 , in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Core i (13th gen)
Raptor Lake-S Common features:
Socket: LGA 1700 . All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM. All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0 , but support may vary depending on motherboard and chipsets. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models. E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores). Fabrication process: Intel 7 . Turbo Boost version is 2.0.
Raptor Lake-U Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Raptor Lake-P Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Raptor Lake-H Common features:
Socket: BGA 1744. All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5 -6400 or LPDDR4X -4266 RAM. All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH. All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). L1 cache :P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 4 MB per E-core cluster (each "cluster" contains four cores). Fabrication process: Intel 7 .
Core / Core Ultra 3/5/7/9 (Series 1)
Meteor Lake-PS Common features:
Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S). All the CPUs support dual-channel DDR5-5600 RAM. All CPU models provide 20 lanes of PCIe 4.0 . All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH). Includes integrated graphics based on Alchemist architecture. L1 cache :P-cores: 112 KB (48 KB data + 64 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core. L2 cache:P-cores: 2 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores). All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache. Fabrication process: Intel 4 (compute tile). Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.
See also
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External links Search MDDS Database Intel ARK Database SSPEC/QDF Reference (Intel) Intel® Processor Names, Numbers and Generation List Intel CPU Transition Roadmap 2008–2013 Intel Desktop CPU Roadmap 2004–2011 Intel Core Solo mobile processor product order code table Intel Core Duo mobile processor product order code table Intel Core Duo Processor and Core Solo Processor on 65 nm Process Datasheet Intel Core Duo Processor and Core Solo Processor on 65 nm Process Specification Update Intel Core 2 Duo Processors Technical Documents Intel Core i3 desktop processor product order code table Intel Core i3 mobile processor product order code table Intel Core i5 desktop processor product order code table Intel Core i5 mobile processor product order code table Intel Core i7 desktop processor product order code table Intel Core i7 mobile processor product order code table Intel Core i7 desktop processor Extreme Edition product order code table Intel Core i7 mobile processor Extreme Edition product order code table Intel's Core i7 web page Intel's Core i7 Extreme Edition web page Intel's Core i7 Processor Numbers Intel's Core i7 Extreme Edition Processor Numbers Intel Corporation – Processor Price List Intel Corporation – Processor Price List Intel Core X-series processors
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