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HiSilicon

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[2][3] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.[4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[6] In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses[7] as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards[8] due to this disruption of its supply chain. On August 29, 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which is used on its latest Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

History

HiSilicon was Huawei's ASIC design center, which was founded in 1991.

Smartphone application processors

HiSilicon Hi6250

HiSilicon develops SoCs based on the ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[11] and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[12] The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

K3V2E

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Kirin 620

• supports – USB 2.0 / 13 MP / 1080p video encode

Kirin 650, 655, 658, 659

Kirin 710

Kirin 810 and 820

Kirin 8000

HiSilicon Kirin 8000 is a mid-range Kirin 8 series chip not officially announced, however, it was released along with the announcement of Huawei nova 12.[18]

Kirin 910 and 910T

Kirin 920, 925 and 928

• The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel

Kirin 930 and 935

• supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Kirin 950 and 955

• supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

Kirin 960

Kirin 970

Kirin 980 and Kirin 985 5G/4G

Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.

Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology.

Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G

Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.[30]

Kirin 9000 5G/4G and Kirin 9000E, Kirin 9000L

Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV) TSMC technology (N5 node) and the first 5 nm SoC to be launched on the international market.[32] This octa-core system on a chip is based on the 9th Gen of the HiSilicon Kirin series and is equipped with 15.3 billion transistors in a 1+3+4 core configuration: 4 Arm Cortex-A77 CPU (1x 3.13 GHz and 3x 2.54 GHz), 4 Arm Cortex-A55 (4x 2.05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) The Kirin 9000L uses a 1+2+3 core configuration: 3 Arm Cortex-A77 (1x 3.13 GHz and 2x 2.54 GHz), 3 Arm Cortex-A55 (3x 2.05 GHz) and a 22-core Mali-G78 GPU with Kirin Gaming+ 3.0 implementation.[32]

The integrated quad pipeline NPU (Dual Big Core + 1 Tiny Core configuration) is equipped with the Kirin ISP 6.0 to support advanced computational photography. The Huawei Da Vinci Architecture 2.0 for AI supports 2x Ascend Lite + 1x Ascend Tiny (only 1 Lite in 9000E/L). The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series). Due to the integrated 3rd generation 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA Sub-6 GHz connectivity.[32] The SoC's TDP is 6W.

The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies. The Kirin 9006C is a rebranded variant of the Kirin 9000E for the Huawei Qingyun L420 and L540 laptops.[33][34]

Kirin 9000S and Kirin 9010 Family

The Kirin 9000S, Kirin 9000S1, and Kirin 9010 of the Kirin 9000 Hi36A0 family are the first HiSilicon-developed SoCs manufactured in high volumes in mainland China by SMIC. The SoC had its debut with the Huawei Mate 60 in late 2023 with the Kirin 9000S alongside overclocked enhancements of the Kirin 9000S1 and Kirin 9010 with the Huawei Pura 70 series in early 2024.[35] According to Tom's Hardware, the Taishan V120 core, developed by HiSilicon, was roughly on par with AMD's Zen 3 cores from late 2020.[36] Four of these cores were used in the 9000 series alongside four efficiency-focused Arm Cortex-A510 cores.[37] The SoCs are based on SMIC's 7nm technology node, referred to as "N+2". It also includes 1 Da Vinci "big" NPU core and 1 Da Vinci "small" NPU core. Kirin 9000W, a Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi only model, debuted in global markets in Q1 2024. The Kirin 9010 and Kirin 9000S1 debuted in Q2 2024, using a modified 2+6+4 core configuration with a new large Taishan core with the same configurations of medium and small cores from the Kirin 9000S with faster enhancements over the Kirin 9000S.[38]

Smartphone modems

HiSilicon develops smartphone modems which are primarily used in its parent company Huawei's handheld and tablet devices.

Balong 700

The Balong 700 supports LTE TDD/FDD.[41] Its specs:

Balong 710

At MWC 2012, HiSilicon released the Balong 710.[42] It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710 was designed to be used with the K3V2 SoC. Its specs:

Balong 720

The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate.[41] Its specs:

Balong 750

The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and 3.5 GHz.[41] Its specs:

Balong 765

The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network.[43] Its specs:

Balong 5G01

The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave (mmWave).[41] Its specs:

Balong 5000

The Balong 5000 is the world's first 7 nm TSMC 5G multi-mode chipset (launched in Q1 2019), the world's first SA/NSA implementation, and the first smartphone chipset to support the full NR TDD/FDD spectrum.[44] The modem has an advanced 2G, 3G, 4G, and 5G connectivity.[45] Its specs:

Wearable SoCs

HiSilicon develops SoCs for wearables such as wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear, and smartwatches.[47]

Kirin A1

The Kirin A1 (Hi1132) was announced on 6 September 2019.[47] It features:

Kirin A2

The Kirin A2 was announced on September 25, 2023.[49] It features:

Server processors

HiSilicon develops server processor SoCs based on the ARM architecture.

Hi1610

The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:

Hi1612

The Hi1612 is HiSilicon's second generation server processor launched in 2016. It is the first chiplet-based Kunpeng with two computing dies. It features:

Kunpeng 916 (formerly Hi1616)

The Kunpeng 916 (formerly known as Hi1616) is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server.[51][52][53][54] It features:

Kunpeng 920 (formerly Hi1620)

The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, and launched in 2019. Huawei claims the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006.[55] The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server, and TaiShan XA320 V2 High-Density Server Node.[56][57][58] It features:

Kunpeng 930 (formerly Hi1630)

The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021. It features:

Kunpeng 950

The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.

AI acceleration

HiSilicon also develops AI Acceleration chips.

Da Vinci architecture

Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine (4096 FP16 MACs + 8192 INT8 MACs), a vector unit (2048bit INT8/FP16/FP32), and a scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks (CANN).[31]

Ascend 310

The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16.[61] The Ascend 310 features:

Ascend 910

The Ascend 910 is an AI training SoC, it was codenamed Ascend-Max. which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8. The Ascend 910 features:

See also

References

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External links