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List of AMD mobile processors

Features overview

CPUs

APUs

APU features table

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Kite platform (2006)

Introduced in 2006, the Kite platform consists of:

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

Sempron

"Huron" (65 nm, Low power)

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V[4]

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Congo platform (2009)

The Congo platform [5] was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Tigris platform (2009)

The Tigris platform [6] introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

Sempron

"Caspian" (45 nm)

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Athlon II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Turion II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Nile platform (2010)

The Nile platform [7][8] introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

V series

"Geneva" (45 nm)

Single-core mobile processor


Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processorSingle-core mobile processor

Dual-core mobile processor


Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor


Danube platform (2010)

The Danube platform[7][10] introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

V series

Champlain (45 nm)

Single-core mobile processor


Athlon II

Champlain (45 nm)

Dual-core mobile processor


Turion II

Champlain (45 nm)

Dual-core mobile processor


Phenom II

Champlain (45 nm)

Dual-core mobile processor


Triple-core mobile processors


Quad-core mobile processors


Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions.[11][12][13][14] This platform consists of:

"Ontario" (40 nm)

"Zacate" (40 nm)

Sabine (Fusion) platform (2011)

The Sabine platform[15] introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

"Llano" (32 nm)

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

"Ontario", "Zacate" (40 nm)

Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

"Trinity" (2012, 32 nm)

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

"Temash" (2013, 28 nm)

Elite Mobility APU:

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

Mainstream APU:

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

Kaveri (2014)

Carrizo-L (2015)

Carrizo (2015)

Bristol Ridge (2016)

"Raven Ridge" (2017)

  1. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as PRO version[32][33][34], released April 8, 2019.

"Renoir" (2020)

U

  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

H

  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.

"Cezanne" (2021)

U

  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d Model also available as Pro version as 5450U,[44] 5650U,[45] 5850U,[46] released on March 16, 2021.

H

  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

"Barceló" (2022)

  1. ^ All of the iGPUs are branded as AMD Radeon Graphics.
  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c Model also available as Pro version as 5475U,[60] 5675U,[61] 5875U,[62] released on April 19, 2022.
  2. ^ a b c Model also available as Chromebook optimized version as 5425C,[63] 5625C,[64] 5825C,[65] released on May 5, 2022.

"Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Unified shaders : texture mapping units : render output units and compute units (CU)
  3. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  1. ^ a b c d e f g h Model also available as PRO version (6650U[67], 6650H[68], 6650HS[69], 6850U[70], 6850H[71], 6850HS[72], 6950H[73], 6950HS[74]), released on April 19, 2022.

Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  3. ^ a b Model also available as Chromebook optimized version as 7520C[76] and 7320C[77] released on May 23, 2023


Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  2. ^ Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:

  1. ^ Core Complexes (CCX) × cores per CCX or Zen 4 + Zen 4c cores
  2. ^ a b c d e PRO versions launched on 13 June 2023.
  3. ^ a b c China-only version of the HS SKU that lacks support for AMD EXPO and FreeSync technologies.
  4. ^ a b Zen 4 cores' base frequency / Zen 4c cores' base frequency
  5. ^ a b Zen 4 cores' boost frequency / Zen 4c cores' boost frequency

Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

  1. ^ Core Complexes (CCX) × cores per CCX
  1. ^ Self identifies as "AMD Radeon 610M". See RDNA 2 § Integrated graphics processors (iGPs).
  2. ^ Only one of the two CCXes has additional 64 MB of 3D V-Cache. Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.

See also

References

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External links